Home TendersSilver Solder Dia 1.5mm Confirming To Is:2927, Gr:ba cu Ag 15, Rosin Core Solder Wire Grade: 60/40 (sn/pb) Size: 0.8 Mm As Per Is 1921-75 In 0.5 Kg Spool., lead Free (sac305) Rohs Compliant Solder Wire specification: Composition: Sn 96.5%, Ag 3%, Cu 0.5 %size : 0.5mm In 500 Gms Roll., Rosin Core Solder wire Five Core Dia.1.5mm (60/40 :tin&lead)., Rosin multicore Solder Wire 26 Swg, (60/40 :tin & Lead) size: Dia 0.46mm., Solder Alloy Wire Dia 0.81mm( Sn 63/pb 37), Flux : 245 No Clean, Flux Percentage : 2.2%, in 500 Gms Spool., Flux, Soldering Liquid, Rosin Base mildly Activated (rma) Non-corrosive As Per Hal std:2701, As Per Standard: Ipc-j-std-004.

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Silver Solder Dia 1.5mm Confirming To Is:2927, Gr:ba cu Ag 15, Rosin Core Solder Wire Grade: 60/40 (sn/pb) Size: 0.8 Mm As Per Is 1921-75 In 0.5 Kg Spool., lead Free (sac305) Rohs Compliant Solder Wire specification: Composition: Sn 96.5%, Ag 3%, Cu 0.5 %size : 0.5mm In 500 Gms Roll., Rosin Core Solder wire Five Core Dia.1.5mm (60/40 :tin&lead)., Rosin multicore Solder Wire 26 Swg, (60/40 :tin & Lead) size: Dia 0.46mm., Solder Alloy Wire Dia 0.81mm( Sn 63/pb 37), Flux : 245 No Clean, Flux Percentage : 2.2%, in 500 Gms Spool., Flux, Soldering Liquid, Rosin Base mildly Activated (rma) Non-corrosive As Per Hal std:2701, As Per Standard: Ipc-j-std-004.

Hindustan Aeronautics Limited(HAL)

Telangana

Closes 19 Jun 2026

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Tender Details

Opening Date

19 Jun 2026

Closing / Bid Deadline

19 Jun 2026

Contract Value

Not Disclosed

EMD Amount

Nil / Not Applicable

Location

K.V.Rangareddy, Telangana

Tender Timeline

Published

Deadline

Published29 May 2026

Bid Submission19 Jun 2026Active

Bid Opening19 Jun 2026

AwardTBD

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Scope of Work

SILVER SOLDER DIA 1.5MM CONFIRMING TO IS:2927, GR:BA CU AG 15, ROSIN CORE SOLDER WIRE GRADE: 60/40 (SN/PB) SIZE: 0.8 MM AS PER IS 1921-75 IN 0.5 KG SPOOL., LEAD FREE (SAC305) ROHS COMPLIANT SOLDER WIRE SPECIFICATION: COMPOSITION: SN 96.5%, AG 3%, CU 0.5 %SIZE : 0.5MM IN 500 GMS ROLL., ROSIN CORE SOLDER WIRE FIVE CORE DIA.1.5MM (60/40 :TIN&LEAD)., ROSIN MULTICORE SOLDER WIRE 26 SWG, (60/40 :TIN & LEAD) SIZE: DIA 0.46MM., SOLDER ALLOY WIRE DIA 0.81MM( SN 63/PB 37), FLUX : 245 NO CLEAN, FLUX PERCENTAGE : 2.2%, IN 500 GMS SPOOL., FLUX, SOLDERING LIQUID, ROSIN BASE MILDLY ACTIVATED (RMA) NON-CORROSIVE AS PER HAL STD:2701, AS PER STANDARD: IPC-J-STD-004.